• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a device (1) for optically measuring at least one dimension of an object (2), in particular a flat object (2) such as a wafer, comprising at least one substantially punctiform, divergent light source (3), at least one of the light source (3 ) opposite detector (4) and at least one manipulation unit (7) for holding and / or moving the object (2). According to the invention, it is provided that the device (1) is formed with more than one divergent light source (3) lying opposite the detector (4). Furthermore, the invention relates to a method for optically measuring at least one dimension of an object (2), in particular a flat object (2) such as a wafer, wherein the object (2) illuminates with point-like divergent light and its projection from at least one located in the radiation area Detector (4) is detected, wherein at least two light sources (3) are detected with at least two projections on the at least one detector (4) and from data obtained thereby a depth information of the object (2) is determined. As a result, a device (1) and a method according to the invention enable a simple, robust construction, a low susceptibility to soiling as well as an additional determination of depth information with only minimal design effort.
    公开号:AT510605A4
    申请号:T799/2011
    申请日:2011-05-31
    公开日:2012-05-15
    发明作者:Thomas Jermann
    申请人:Jerman Thomas；
    IPC主号:
    专利说明:

    1 1
    • «♦ * *» · · · · · • · * ·
    Device and method for the optical measurement of at least one dimension of an object by means of punctiform, divergent light sources
    The invention relates to a device for optically measuring at least one dimension of an object, in particular a flat object such as a wafer, comprising at least one substantially punctiform, divergent light source, at least one detector opposite the light source and at least one manipulation unit for holding and / or moving the object ,
    Furthermore, the invention relates to a method for the optical measurement of at least one dimension of an object, in particular a flat object such as a wafer, wherein the object is illuminated with punctiform divergent light and whose projection is detected by at least one detector located in the radiation area.
    Various methods and devices for the optical measurement of a dimension of an object are known from the prior art. In this case, methods or devices have proven to be particularly favorable based on punctiform, divergent light sources, as this is dispensed with a complex optics for parallelization of serving for a projection light and thus both the sensitivity to dirt is reduced as well as optically caused aberrations omitted.
    An example of such a device is described in DE 101 61 226 A1. Although this device has all the advantages mentioned above, it is limited to the measurement of only one dimension and additionally requires a constant distance between the light source and the measurement object or a determination of this by a further measurement independent of the device or an additional mathematical relationship.
    DE 197 57 067 A1 describes a method for measuring the diameter of a strand, in particular a cable of smaller diameter, without interposing an imaging optical system with the light of at least one monochromatic light source punctiform in the measurement plane. Since, in this method, the distance between the light source and the cable strand to be measured varies, an additional relationship is necessary, which is obtained by evaluating the diffraction seams on the 2
    ι. »•«
    Shadow boundaries of the projection is taken into account. The disadvantage here is that the diffraction fringes can be falsified by dirt particles and thus the achieved by not using a lens system advantage of a lower susceptibility to soiling is at least partially nullified.
    On the other hand, WO 2010/118449 A2 describes a planar detector intended for use on light curtains, which generates electrical signals as a function of absorbed light and is provided with a number of tapping points for the generated signals, the size of the signals being at the individual tap points depends on their distance to the faces. Although an automatic determination of the position and dimensions of an object is described in this document, it is not readily possible to measure the coordinates of the surface or the edges of the object partly or as a whole, and moreover requires that the Shadow throws caused by light sources are always detected in their entirety and a more complex structure or evaluation than described in DE 101 61 226 A1.
    Although such methods or devices are well suited for the respective application, they are not or only poorly able to determine additional depth information, that is to say a distance between a light source and an object edge or an object edge and a detector. As a non-limiting illustrative example, the measurement of wafers is mentioned. In the course of wafer processing, in particular with wafers having a thickness of 300 μm and below, material stresses occur which cause a not insignificant deflection of the wafer. However, since in certain semiconductor processing steps, for example in a lithography step, as exact alignment of the wafer is necessary in order to achieve an optimal process result, it is necessary to also detect the deflection of the wafer. This is not possible with or with devices or methods described above or only possible by two or more independent one-dimensional measuring devices, which, however, to an unnecessary increase in the complexity of the process or unnecessary multiplication of the device and / or its components and lead to an increased space requirement. 3 • · # »* * * * * * * * *
    The object of the invention is to provide a device of the type mentioned, which allows a simple and robust construction, is as insensitive to dirt and additionally ensures the determination of a depth information.
    Another object is to provide a method of the type mentioned, which allows a simple and robust method for a device according to the invention, is as insensitive to dirt and additionally ensures the determination of depth information.
    The first object is achieved if a device of the type mentioned above is formed with more than one divergent light source opposite the detector.
    An advantage achieved by the invention is to be seen in particular in that the determination of depth information is possible by training with more than one point, divergent light source, without having to do without a simple, robust construction or a low susceptibility to soil. In addition, the device, due to its simple construction and a favorable low number of components, requires very little space and allows a simple installation in or extension of existing systems.
    It has proven useful if at least one light source has a fan-shaped radiation characteristic in order to allow optimal illumination of a measurement plane and / or of the at least one detector.
    It is advantageous if the light sources are arranged in one plane. This allows a compact design and a simple mathematical modeling of the device.
    Advantageously, at least two light sources are arranged along a straight line in order to enable an even more compact design and an even simpler mathematical modeling of the device. 4 4 * * t * t * MM * m * * * * * # * * * * * * * i * * * * *
    In a device according to the invention, the at least one detector is preferably designed as an optoelectronic detector. This results in the advantage of digital acquisition and evaluation of the measurement data.
    It is also advantageous if at least one control unit and at least one evaluation unit are provided and the at least one manipulation unit is in operative connection with the control unit. This is particularly favorable since both the object can be optimally positioned for a measurement and the surface of the object can be measured in parts or as a whole and the coordinates and / or dimensions of the object can be determined by the evaluation device from the obtained measurement data.
    As a rule, the at least one manipulation unit is rotatable and / or displaceable parallel or perpendicular to a measuring plane in order to ensure optimum positioning of the object and / or both individual measurements and measurement series with defined geometrical relationships.
    It is preferred if the at least one manipulation unit is positioned between the at least one detector and the light sources in order to set an enlargement of the projection and / or a minimization of a projection error.
    Particularly preferably, at least one measuring plane runs parallel to the beam path of at least one light source in order to achieve a maximization of a measuring range.
    Advantageously, the device has at least one positioning unit for aligning the object. This allows an exact positioning of the object for a subsequent processing step.
    Advantageously, a device according to the invention is used for a measurement of substantially disc-shaped objects, since such objects cause only a very small measurement error in depth.
    Preferably, a device according to the invention is used when the object is formed as a wafer, preferably with a thickness of less than 300 pm, 5 in particular less than 150 pm. The use of this is advantageous, since such wafer thicknesses in the semiconductor processing are often prevalent and a deflection due to stresses at these thicknesses is particularly pronounced. Usually, a device according to the invention, for measuring and / or positioning and / or aligning wafers in transport boxes and / or before a semiconductor processing step, is used to align the wafer as exactly as possible to one or more defined crystal orientations and thus subsequently better product properties and a lower committee.
    The further goal is achieved if, in a method of the aforementioned type, at least two light sources with at least two projections are detected on the at least one detector and a depth information of the object is determined from data obtained thereby. The resulting advantage lies in the two- or three-dimensional measurement of the edges or surfaces of objects and the depth information contained therein. In addition, such a method ensures a simple and robust construction and only a low sensitivity to dirt.
    It is also advantageous if at least one measuring plane between the light sources and the at least one detector is clamped in order to maximize a measuring range.
    Advantageously, coordinates of one or more edges of an object in at least one measurement plane are determined in order to detect the surface of the object in parts or as a whole.
    Preferably, obtained measurement data are used for a measurement, positioning and / or alignment of objects. This allows an improvement in product quality, a reduction in rejects and, ultimately, environmental protection.
    It is also advantageous if obtained measurement data are used for a measurement of a position, height, width or diameter of both transparent and non-transparent objects in order to open up an even wider field of application. 6 4 * • »
    * # ♦ *
    Further features, advantages and effects of the invention will become apparent from the embodiment illustrated below. In the drawings, to which reference is made, show:
    1 shows a device according to the invention with a manipulation unit perpendicular to a measuring plane;
    Fig. 2 is a diagram of an information flow when using a device according to the invention;
    3 shows a device according to the invention with a manipulation unit parallel to a measuring plane;
    4 shows an exemplary detector signal caused by exposure of a non-transparent object from a punctiform, divergent light source of a device according to the invention;
    5 shows an exemplary detector signal caused by exposure of a transparent object from a punctiform, divergent light source of a device according to the invention.
    A non-limiting embodiment of a device 1 according to the invention and of a method according to the invention is shown in FIGS. 1 to 5. A device 1 according to the invention comprises more than one punctiform, divergent light source 3, at least one manipulator 4 opposite thereto, at least one manipulation unit 7 positioned between the light sources 3 and the at least one detector 4, a control unit 5 which controls an interaction between the light sources 3, Detector 4 and the manipulation unit 7 coordinates, and an evaluation unit 6, which prepared by the control unit 5 measurement data and brings in a usable for an optional positioning unit 9 form and / or the calculated coordinates of the edges or surface of the object 2 for external use and / or stores them in a format suitable for further use.
    The punctiform, divergent light sources 3 and the object 2 to be measured cause a plurality of shadow throws on the at least one detector 4. In principle, any punctiform, divergent light sources 3 for use in the device 1 are conceivable. In the case of a particularly compact embodiment of a 7 according to the invention
    Device 1 prove to be light-emitting diodes and / or lasers such as solid-state lasers, in particular laser diodes with integrated optics, as particularly advantageous, with both different and identical wavelengths can be used for these. Depending on the application, provision may be made for the light sources 3 to be actuated individually, in pairs 5 or groups, but also as a whole in order to measure the projections caused by the object 2 or the different intensity profiles of the light sources 3 on the at least one detector 4 for a calibration of the device 1 to capture. In addition, the light sources 3 are arranged along one or more straight lines and / or positioned in a plane in order to be able to calculate the coordinates of one or more edges of the object 2 by means of simple geometric relationships, eg. B. by means of one or more similarity theorems, in particular angle and / or radiation sets. Moreover, it may be advantageous if, under the available light sources 3, individual light sources 3 are combined in pairs or groups in order to minimize 15 aberrations caused by the geometry of the object 2, a sensitivity of the device 1 or of the
    To adjust method as well as device parameters such as effective height and / or base of the device 1 to determine. In order to supplement the inherent two-dimensional section of the object 2 to be measured with a measurement plane 8 to a partial or complete measurement of the surface of the object 2, it may be provided that 20 fan-shaped or radial emission characteristics of at least two light sources 3 generate a divergently illuminated measurement plane 8 and the emitted light, by rotating or rotatably mounted reflective surfaces such as mirrors, on the object 2 and one or more underlying detectors 4 is pivoted. However, it is also possible to combine a plurality of measurement planes 8 for the simultaneous measurement of several sections by one or more detectors 4.
    The detector 4 is designed as at least one optoelectronic device and converts the intensity profile caused by one or more projections into signals that can be evaluated electronically. The detector 4 may be formed in one or more parts as well as cellular as well as flat. A conversion of the optical signal into an electrical signal can be effected by phototransistors, photodiodes, photoresistors or in particular CCD or CMOS sensors as well as similarly suitable components or their combination. By a combination of a plurality of cell-shaped detectors and / or one or more areal detectors 4 * For example, several sections can be determined simultaneously or sequentially, and the surface of the object 2 to be measured can be detected partially or in entirety. In addition, by a favorable positioning of the object 2 in a measuring plane 8, a magnifying projection can be achieved (when the object 2 is closer to the light sources 3 than the at least one detector 4), which allows to measure with a greater resolution than the at least one detector 4 has.
    The manipulation unit 7 is positioned between the light sources 3 and the at least one detector 4 and mounted displaceably and / or rotatably along one or more axes, whereby a rotation or translation takes place parallel or perpendicular to a measuring plane 8 (FIGS. 1 and 3). By the translation and / or rotation of the Manipuiationseinheit 7, it is possible to scan the edges or surface of the object 2 partially or as a whole. When using the device 1 for the measurement of wafers, the manipulation unit 7 is conveniently designed as a holder and may have a vacuum device for sucking and / or holding a wafer. Moreover, it is particularly advantageous if a support diameter of the holder is smaller than a wafer diameter. Alternatively, however, it is also possible for the manipulation unit 7 to be designed as a conveyor belt or a similar unit in order to measure one or more objects 2 as they pass, for example during a transport from one process step to a subsequent one.
    In principle, each object 2 can be measured in a device 1 or by means of a method according to the invention which is capable of propagating emitted electromagnetic radiation from more than one light source 3, in particular visible and / or invisible light such as ultraviolet and / or to influence infrared radiation such that this influence in at least one of the light sources 3 compatible detector 4 measurably appears, for example in the form of one or more shadow throws.
    An exemplary detector signal 10, which is processed by means of the evaluation unit 6 and caused by a divergent light source 3, is illustrated in FIG. 4 and typically not for use of a wavelength for the object 2 to be measured is transparent.
    A further example of a detector signal 11 processed by means of the evaluation unit 6 is shown in FIG. 5, wherein an object 2 to be measured, for the divergent light source 3 used, is at least partially transparent.
    It is particularly advantageous if the object 2 to be measured is predominantly flat, since a possible projection error caused by a dimension, in terms of height or thickness, of the object 2 is almost eliminated and the assumption of a point-shaped edge for the mathematical modeling of the projection , in the best possible way coincides with the real measuring conditions. An example of this is the measurement of the deflection of wafers called (FIG. 1).
    The control unit 5 (FIG. 2) coordinates control of the light sources 3, control and read-out of one or more detectors 4, one or more orientations or movements of the manipulation unit 7, and read-out or control of possibly existing sensors and / or actuators. In addition, the control unit 5 provides received measurement data for further evaluation and may be embodied as a PC, a microcontroller, an embedded system, a programmable logic controller or a similar suitable unit.
    The evaluation unit 6 (FIG. 2) calculates the coordinates of the edges or surface of the object 2 from the measurement data provided by the control unit 5. In addition, the evaluation unit 6 can calibrate the parameters required for the measurement from the measurement data obtained from the control unit 5, z. Effective height and / or base. From the calculated coordinates, the required properties of the object 2 such as diameter, position, deflection, area, volume, etc. are determined by the evaluation unit 6 and prepared for further use. This can be done by converting the data into a corresponding protocol or file format and by storing and / or transmitting to another external unit, eg. B. a positioning unit 9, done. For a construction of a fully enclosed and / or very compact • 9 «· · · · * T ·» · »« «φ · * · · ft» ♦ * t · 9 · * 10
    Device 1, it may be advantageous if the evaluation unit 6 and the control unit 5 are combined in one unit.
    The data provided by the evaluation unit 6 can be used, for example, by a positioning unit 9 in order to align a wafer precisely for a subsequent semiconductor processing step. This is advantageous in that, by aligning with one or more crystal axes of the semiconductor, components having improved properties, less rejects and, as a result, less resources are used.
    The measurement principle described above is not only suitable for the measurement of wafers but also for a measurement of objects 2 with similar surface properties. In addition, the method is not limited to the measurement of an edge of an object 2, but can also measure several edges of an object 2 and / or several objects 2 simultaneously or alternately. Furthermore, the device 1 and a method according to the invention are suitable for making the diameter of one or more objects 2 and / or a width and / or height measurement of one or more objects 2. In addition, a method according to the invention can also be used without a manipulation unit 7 to measure one or more objects 2, e.g. B. when flying and / or falling through one or more measurement levels. 8
    The data obtained by a device 1 according to the invention or a method according to the invention can be visualized on one or more displays and / or fed to a statistical evaluation in order to investigate the influence of the semiconductor processing and / or the positioning of the wafer on the end product during the production process using the knowledge gained from this, to carry out a corresponding process optimization or quality management. In summary, a device 1 and a method according to the invention enable a simple, robust construction, a low susceptibility to soiling as well as an additional determination of depth information with only minimal design effort.
    权利要求:
    Claims (18)
    [1]


    1. Device (1) for optically measuring at least one dimension of an object (2), in particular a flat object (2) such as a wafer, comprising at least one substantially punctiform, divergent light source (3), at least one of the light source (3) opposite detector (4) and at least one manipulation unit (7) for holding and / or moving the object (2), characterized in that the device (1) with more than one detector (4) opposite divergent light source (3) is formed ,
    [2]
    2. Device (1) according to claim 1, characterized in that at least one light source (3) has a fan-shaped radiation characteristic.
    [3]
    3. Device (1) according to claim 1 or 2, characterized in that the light sources (3) are arranged in a plane.
    [4]
    4. Device (1) according to one of claims 1 to 3, characterized in that at least two light sources (3) are arranged along a straight line.
    [5]
    5. Device (1) according to one of claims 1 to 4, characterized in that the at least one detector (4) is designed as an optoelectronic detector (4).
    [6]
    6. Device (1) according to one of claims 1 to 5, characterized in that at least one control unit (5) and at least one evaluation unit (6) are provided and the at least one manipulation unit (7) with the control unit (5) is in operative connection ,
    [7]
    7. Device (1) according to one of claims 1 to 6, characterized in that the at least one manipulation unit (7) is mounted rotatably and / or displaceably parallel or perpendicular to a measuring plane (8).
    [8]
    8. Device (1) according to one of claims 1 to 7, characterized in that the at least one manipulation unit (7) between the at least one detector (4) and the light sources (3) is positioned. * * · · I · · »**« · 4 I t t · V · a * * · * t t · φ · · 4 · t 4 · 4 t a 12
    [9]
    9. Device (1) according to one of claims 1 to 8, characterized in that at least one measuring plane (8) parallel to the beam path of at least one light source (3).
    [10]
    10. Device (1) according to one of claims 1 to 9, characterized in that the device (1) has at least one positioning unit (9) for aligning the object (2).
    [11]
    11. Use of a device (1) according to one of claims 1 to 10 for the measurement of substantially disc-shaped objects (2).
    [12]
    12. Use of a device (1) according to claim 11, wherein the object (2) is a wafer, preferably with a thickness of less than 300 pm, in particular less than 150 pm.
    [13]
    13. Use of a device (1) according to one of claims 1 to 10 for the measurement and / or positioning and / or alignment of wafers in transport boxes and / or before a semiconductor processing step.
    [14]
    14. Method for optically measuring at least one dimension of an object (2), in particular a flat object (2) such as a wafer, the object (2) being illuminated with point-like divergent light and its projection projecting from at least one detector (4) located in the radiation area ), characterized in that at least two light sources (3) with at least two projections on the at least one detector (4) are detected and from the data obtained thereby a depth information of the object (2) is determined.
    [15]
    15. The method according to claim 14, characterized in that at least one measuring plane (8) between the light sources (3) and the at least one detector (4) is clamped.
    [16]
    16. The method according to claim 14 or 15, characterized in that coordinates of one or more edges of an object (2) in at least one measuring plane (8) are determined. ·· * «* · * ·» • ♦ ♦ · f ♦ «» · · > • * * * ♦ ♦ »· • * · ·« «· ·« 13
    [17]
    17. The method according to any one of claims 14 to 16, characterized in that obtained measurement data for a measurement, positioning and / or alignment of objects (2) are used.
    [18]
    18. The method according to any one of claims 14 to 17, characterized in that the measured data obtained for a measurement of a position, height, width or diameter of both transparent and non-transparent objects (2) are used.
    类似技术:
    公开号 | 公开日 | 专利标题
    EP2411787B1|2015-08-19|Apparatus for determining particle sizes
    EP2458363B1|2015-11-11|Measurement of the positions of curvature midpoints of optical areas of a multi-lens optical system
    DE102011011065A1|2012-08-16|Method and device for the high-precision measurement of surfaces
    EP2019281A1|2009-01-28|3D sensor and method for operating a 3D sensor
    DE102008062995A1|2010-06-24|3D camera for room surveillance
    EP3199943A1|2017-08-02|Device and method for detecting an at least partially reflective surface
    AT515521A4|2015-10-15|Bending angle measuring device and method for measuring a bending angle by means of the bending angle measuring device
    DE102009032210B4|2011-06-09|processing plant
    DE102011117523B3|2013-04-18|Device for optically determining the surface geometry of a three-dimensional sample
    AT510605B1|2012-05-15|DEVICE AND METHOD FOR THE OPTICAL MEASUREMENT OF AT LEAST ONE DIMENSION OF AN OBJECT BY MEANS OF POINT-LIKE, DIVERTED LIGHT SOURCES
    EP2773928B1|2021-09-22|Sensor for verifying value documents
    WO2012146392A1|2012-11-01|Method and device for characterising physical properties of granular materials
    WO2017045982A1|2017-03-23|Device and method for chromatic confocal examination of a sample
    DE102015217332A1|2016-03-17|POSITION MEASURING DEVICE
    DE102015004163B4|2017-03-23|Apparatus and method for determining properties of a laser beam
    EP3581881A1|2019-12-18|Surface measurement by means of excited fluorescence
    DE102019201272B4|2021-09-16|Device, measuring system and method for detecting an at least partially reflective surface using two reflection patterns
    DE2507040B2|1977-03-03|OPTOELECTRONIC MEASURING DEVICE FOR THE POSITION OF A CONTRASTING EDGE OF AN OBJECTIVE
    DE102018105794A1|2018-09-20|Illustration of an object by means of a shadow
    DE102005026419A1|2006-12-21|Method and device for geometric measurement of flat bodies
    DE102015114575B4|2017-05-24|Device for image control
    DE102014016087B4|2016-03-10|Three-dimensional optical detection of object surfaces
    DE102010036762B4|2017-12-28|Method and device for shape recognition of empties containers in reverse vending machines by means of a light-section triangulation method
    DE202011109943U1|2012-11-15|Device for determining the size of particles in screenings
    WO2010085940A1|2010-08-05|Device and method for non-contacting measurement of a distance and/or profile
    同族专利:
    公开号 | 公开日
    EP2530426B1|2020-06-17|
    AT510605B1|2012-05-15|
    EP2530426A1|2012-12-05|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE19757067A1|1997-12-20|1999-07-01|Sikora Industrieelektronik|Method for measuring the diameter of a strand|
    DE10161226A1|2001-12-13|2003-07-03|Hommelwerke Gmbh|Optoelectrical arrangement for measurement of a workpiece dimension, whereby a divergent point type light source is used in conjunction with a linear photoelectrical detector, so that wide optical components are not required|
    DE10323152A1|2003-05-22|2004-12-16|Hauni Maschinenbau Ag|Device for measuring the diameter of a rod-shaped object, in particular of the tobacco-processing industry|
    US7366344B2|2003-07-14|2008-04-29|Rudolph Technologies, Inc.|Edge normal process|
    SE526211C2|2004-04-29|2005-07-26|Mindproxy Ab|Object contour measuring method, by detecting beams partly blocked by object in between stationary transmitters and receivers|
    WO2008095733A1|2007-02-09|2008-08-14|Tezet Technik Ag|Measuring instrument and method for determining geometric properties of profiled elements|
    DE102007024525B4|2007-03-19|2009-05-28|Vistec Semiconductor Systems Gmbh|Apparatus and method for evaluating defects at the edge area of a wafer|
    AT508135B1|2009-04-16|2010-11-15|Isiqiri Interface Technologies|FLARED OPTICAL DETECTOR SUITABLE FOR LIGHT CURING APPLICATIONS|
    DE102009039657A1|2009-09-02|2011-03-10|Msg Maschinenbau Gmbh|Apparatus and method for measuring the shape of an object|DE102010022273A1|2010-05-31|2011-12-01|Sick Ag|Optoelectronic sensor for detecting object edges|
    EP2801786B1|2013-05-08|2019-01-02|Sick AG|Opto-electronic sensor and method for detecting object edges|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA799/2011A|AT510605B1|2011-05-31|2011-05-31|DEVICE AND METHOD FOR THE OPTICAL MEASUREMENT OF AT LEAST ONE DIMENSION OF AN OBJECT BY MEANS OF POINT-LIKE, DIVERTED LIGHT SOURCES|ATA799/2011A| AT510605B1|2011-05-31|2011-05-31|DEVICE AND METHOD FOR THE OPTICAL MEASUREMENT OF AT LEAST ONE DIMENSION OF AN OBJECT BY MEANS OF POINT-LIKE, DIVERTED LIGHT SOURCES|
    EP12167956.7A| EP2530426B1|2011-05-31|2012-05-14|Device and method for optically measuring at least one dimension of an object with point-shaped, divergent light sources|
    [返回顶部]